- GST NO. : 24AACPM8952F1ZO
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50 Kilogram (MOQ)
| Business Type | Supplier, Retailer |
| Material | Blend Of High-purity Tin,Silver, And Copper Metal Powder |
| Application | Extreme Flux Activity, Enhanced Printing For Ultra-fine Pitch Applications |
| Type | Solder Paste |
| Click to view more | |
Product Details
Composition
SAC305 (Tin-Silver-Copper Alloy)
Flux Type
No-clean Flux
Compatibility
Excellent Wetting On Copper OSP-coatings
Reflow Process Windows
Wide With High Thermal Stability
Printing Characteristics
Repeatable And Consistent
Wettability
Excellent
4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent printing characteristics
- Long stencil and tack life facilitate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmospheres
- Medium-soft, non-cracking residues
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