Solder Pastes

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Non-corrosive
• Non-conductive residue
• Halide-free
• Good wettability
• Type 3 (25-45 µm)

4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Repeatable and consistent printing characteristics
• Long stencil and tack life facilitate high speed printing
• Excellent wettability
• Suitable for air or nitrogen atmospheres
• Medium-soft, non-cracking residues