Chanod, Vapi, Gujarat
Leading Manufacturers, Exporters, Wholesaler, Retailer, Distributor of 8329TCS - Thermal Adhesive, High TC and Medium Cure Thermally Conductive Adhesive (8329TCM) from Vapi.
Business Type | Supplier, Trader, Distributor |
Country of Origin | Canada |
Material | Adhesive |
Application | LEDs, CPUs, and other heat-generating components |
Color | Dark Grey |
Adhesive | Pressure Sensitive |
Packaging Size | 0-25 Kg |
Quality | Best |
Packaging Details | Catalog Number Size Packaging 8329TCS-6ML 14 g (0.49 oz) Dual syringe 8329TCS-50ML 113 g (3.99 oz) 2 Jar kit 8329TCS-200ML 452 g (1.0 lb) 2 Can kit |
Preferred Buyer From
Location | Anywhere in India |
This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.
Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8329TFS) suitable for use with mixing tips.
This adhesive has been formulated to have a long working time. We also offer fast-curing alternatives with 5-minute (8329TCF), and 45-minute (8329TCM) working times. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available.
Business Type | Supplier, Trader, Distributor |
Type | Conductive Adhesive |
Application | Bag Sealing, Carton Sealing |
Color | Creamy |
Adhesive | Pressure Sensitive |
Feature | Heat Resistant |
Shelf Life | 1 Year |
Preferred Buyer From
Location | Anywhere in India |
We are a well-reputed Supplier of Medium Cure Thermally Conductive Adhesive (8329TCM) in Maharashtra, India. The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high-thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies. It resists thermal and mechanical shocks.
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Application Instructions :
To prepare 1:1 (A:B) Mixture :
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