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We are a well-reputed Supplier of Medium Cure Thermally Conductive Adhesive (8329TCM) in Maharashtra, India. The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high-thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot
This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.
Use this thermal adhesive paste to glue
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