Our well-reckoned entity is highly engrossed in supplying Slow Cure Thermally Conductive Adhesive (8329TCS). The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn't require temperatures as high as 130 and 170oC and it will cure at a more moderate 80oC in less than 1 hour. The cured adhesive bonds very well to most of the substrates used in electronic assemblies. It resists thermal and mechanical shocks.
Application : Instructions Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity. To prepare 1:1 (A:B) mixture
|Type||Thermally Conductive Adhesive|
|Use||Thermally Conductive Use|