Slow Cure Thermally Conductive Adhesive (8329TCS)

Our well-reckoned entity is highly engrossed in supplying Slow Cure Thermally Conductive Adhesive (8329TCS). The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn't require temperatures as high as 130 and 170^oC and it will cure at a more moderate 80^oC in less than 1 hour. The cured adhesive bonds very well to most of the substrates used in electronic assemblies. It resists thermal and mechanical shocks.

Features :

• Good low-temperature alternative to 1-part TC adhesives with inconveniently high cure temperature
• Excellent 1.44 W/ (m¢K) thermal conductivity
• Easy 1:1 mix ratio
• Adheres to most electronic substrates
• Stores and ships at slightly below room temperature  no freezing or dry ice required
• Very long shelf life of at least three years  even when stored at room temperature
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

Application : Instructions Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity. To prepare 1:1 (A:B) mixture

• Remove cap or cover.
• Measure one part by volume of A.
• Measure one part by volume of B.
• Thoroughly mix the parts together with a stir stick until homogeneous.
• Apply with an appropriate sized stick for the application area.

Note :

• Remember to recap the syringe or container promptly after use. Tip - Note that the material viscosity decreases with mixing, so the material will be most liquid-like and easily applied immediately after being mixed. Due to short cure time, apply as soon as possible after mixing. To heat cure the 8329TCS Put in oven at 80^oC [176^oF] for 60 minutes.   Tip: Hair dryers are normally rated not to exceed 60^oC, so they can generally be used to accelerate the cure.
• Attention - Keep the curing temperature well below temperature limit of heat sensitive components that may be present. As a guideline, remember that commercial grade devices normally can be safely operated up to 70^oC, industrial grade up to 85^oC, and military grade up to 175^oC.
• Attention - Heat guns can easily exceed the temperature limits for your assembly: they should not be used.

Details :

• The 8329TCS is used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability.
• It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.