Industrial Adhesives

This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

This thermal adhesive paste is most often used to attach heatsinks to CPUs, LEDs, or other heat generating electronic components. It is also suitable in many other applications that require a thermally conductive electrically insulating bond.

This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8349TFM) that is suitable for use with mixing tips.

This adhesive paste has a 45-minute working time. We also offer a faster setting alternative with a working time of only 5 minutes (8329TFM) and 20 minutes (8349TFM), a heat cure 2-part system with a 4-hour working time (8329TCS), and a heat-cure 1-part alternative with an unlimited working time (9460TC). Electrically conductive alternatives and thermal pastes are also available.

Features & Benefits

Thermal conductivity of 1.4 W/(m·K)

1:1 mix ratio

Working time: 45 minutes

Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)

Provides strong electrical insulation

High mechanical strength

Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons

This conductive adhesive is a 1-part, heat-cured system with an unlimited working time. It is a silver grey, smooth, thixotropic paste that cures to form a hard, durable, and electrically conductive polymer. It bonds well to a wide variety of substances.

It is an electrical adhesive glue that is designed for semi-conductor flip chip packaging and die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates. It can be readily used in manual, pneumatic, and robotic dispensing processes.

9410 is a silver filled epoxy adhesive that requires no mixing and is designed to simplify processing. It significantly eliminates waste and accelerates productivity while relieving concerns regarding mix ratios, weighing, and working times. It is stable at room temperature and does not require frozen storage.

For a more conductive version, use 9400. We also offer 2-part heat-cured electrically conductive adhesives with 10-minute (8331), 20-minute (8331D), and 4-hour (8331S) working times, as well as thermally conductive alternatives.

Features & Benefits

• High electrical conductivity
• Creates strong permanent electrical connections
• No mixing, unlimited working time
• Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
• Room temperature storage
• Suitable for automated dispensing

We are a major Supplier of Super Cyanoacrylate Adhesive Liquid (8333). The 8333 Super Glue Liquid is a quick curing, solventless, medium viscosity cyanoacrylate adhesive. Its primary application is to bond parts together without the need of heat or pressure. This adhesive is well-suited to bond rubber to rubber, plastic to plastic, rubber to metal, and plastic to metal applications. This adhesive is not intended as a structural adhesive to join load bearing structures. This cyanoacrylate adhesive has been formulated to quickly bond plastics, metal, and ceramics. It offers excellent strength characteristics. Also available in a gel format.

8331D is an electrically conductive, 2-part silver epoxy adhesive. It is an improved version of our legendary silver-filled epoxy adhesive, 8331. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates.

This electrically conductive silver epoxy allows for quick, cold-soldering repairs. It is considered a solder replacement epoxy for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates.

This DIY conductive epoxy has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, use 8331S.

For a 1-part alternative use 9410 or 9400.

We also offer a full line of thermally conductive electrically insulating epoxy adhesives.

We are counted amongst the prominent Suppliers of Fast Set Epoxy Adhesive (8332). We are based in Maharashtra, India. This adhesive provides 2300 psi bonding strength to paper, wood, metal, and ceramics. It is conveniently packaged in a 25 ml dual syringe with a twist off cap for easy mixing. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents.

Features :

• Easy 1:1 mixing ratio
• Fast setting (5 minutes)
• 2300 psi of bonding strength
• Resistant to water, salt spray, inorganic acids and bases and most organic solvents

Applications : Use to bond paper, wood, metal,most plastics, and ceramics

We are a well-reputed Supplier of Medium Cure Thermally Conductive Adhesive (8329TCM) in Maharashtra, India. The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high-thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies. It resists thermal and mechanical shocks.

 Features :

• Excellent 1.36 W/ (m¢K) thermal conductivity
• Easy 1:1 mix ratio
• Adheres to most electronic substrates
• Stores and ships at slightly below room temperature  no freezing or dry ice required
• Very long shelf life of at least two years  even when stored at room temperature
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

Applications :

• The 8329TCM is used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long-term reliability.
• It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

Application Instructions :

• Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance).
• Heat cure is recommended to get the best possible conductivity.

To prepare 1:1 (A:B) Mixture :

• Remove cap or cover.
• Measure one part by volume of A.
• Measure one part by volume of B.
• Thoroughly mix the parts together with a stir stick until homogeneous.
• Apply with an appropriate sized stick for the application area.

Note :

• Remember to recap the syringe or container promptly after use.

• Tip: Note that the material viscosity decreases with mixing, so the material will be most liquid-like and easily applied immediately after being mixed. Due to short cure time, apply as soon as possible after mixing.
• To heat cure the 8329TCF
• Put in oven at 65^oC [149^oF] for 15 minutes.
• Tip - Hair dryers are normally rated not to exceed 60^oC, so they can generally be used to accelerate the cure.
• Attention - Keep the curing temperature well below temperature limit of heat sensitive components that may be present. As a guideline, remember that commercial grade devices normally can be safely operated up to 70^oC, industrial grade up to 85^oC, and military grade up to 175^oC.
• Attention - Heat guns can easily exceed the temperature limits for your assembly: they should not be used.