We are a well-reputed Supplier of Medium Cure Thermally Conductive Adhesive (8329TCM) in Maharashtra, India. The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high-thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies. It resists thermal and mechanical shocks.
Application Instructions :
To prepare 1:1 (A:B) Mixture :
|Usage||Bag Sealing, Carton Sealing|
|Shelf Life||1 Year|