MG Chemicals

9310 a is general purpose, one-part epoxy adhesive. It is smooth, thixotropic, self-levelling, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature and does not require frozen storage.

• Minimum cure temperature of 100 °C [212 °F]
• Unlimited working life
• Shelf life: 2 years at room temperature
• Provides strong electrical insulation
• Tg of 113 °C [235 °F]
• Strong resistance to humidity, salt water, acids, bases, and aliphatic hydrocarbons

This carbon paint consists of a 1-part,

419D is a fast drying, acrylic based circuit board protective coating that cures to a durable, flexible and smooth finish. This 1-part circuit board coating is easy to apply and can be handled in 10 minutes. It can be readily removed with appropriate

402A Super Duster 134 is a pure, non-flammable electronics duster that can be used on live electronics and electrical equipment. This electronics duster spray contains pure

The 500 Series are copper clad laminates consisting of continuous woven glass cloth impregnated with epoxy resin. Compared to a 2 oz. copper clad board, 1oz. boards contain less copper making the etching process much quicker. They are made of FR4, which is a flame retardant version of G-10 material.

• Comply with UL (file number E214381) and IPC-4101C/21
• DICY (dicyandiamide) Cured System
• Easy to cut, with no specialized equipment required
• UV blocking
• Available in 1 oz (1.37 mil, 35 µm) and ½ oz (0.67 mil, 17 µm) copper cladding
• Available in 1/16” (1.60 mm) and 1/32” (0.80 mm) laminate thicknesses

This carbon paint consists of a 1-part,

This thermal conductive glue is a 2-part, one-one system with a set time of only 15 minutes. The adhesive is a smooth off-white paste that cures to a hard, durable polymer. Once cured, the epoxy is thermally conductive, yet electrically insulating. 8329TFF is UL 94 V-0 registered as flame retardant (

Our Rosin Flux Pen contains a rosin-based liquid flux with moderate activity. The flux is composed of pure Water White (WW) grade gum rosin in a unique solvent system, with highly effective activators. Post-soldering residues are non-conductive, non-corrosive, hydroscopic, and fungus resistant.

• Flux meets IPC J-STD-004B and type ROM1
• For both leaded and lead-free solders
• Chiseled tip allows precise application
• Fast wetting

TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.

• Thermal conductivity of 2.5 W/m•K
• Quick low-temperature cure
• 1:1 mix ratio
• Flame retardant—meets UL 94V-0
• Reworkable