Silicone CPU Thermal Paste

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50 Kilogram (MOQ)

Business Type Supplier, Retailer
Application CPU Applications
Type Thermal Paste
Material Silicone-based
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Product Details

Thermal Conductivity
0.7 W/(m·K)
Dielectric Strength
High
Service Temperature Range
-40 To 200 °C (-40 To 392 °F)
Corrosion Resistance
Excellent
Service Life
Long

he 860 is a CPU thermal paste that is silicone-based. Thermal grease like our 860 reduces thermal resistance between irregular metal surfaces. This thermal compound paste has reasonable thermal conductivity, a soft consistency and a wide operating temperature range. In some instances, these properties makes it the best thermal paste for CPU applications.

The 860 is a silicone thermal compound that is not an adhesive. While it mates the CPU to the heat sink, it does not form permanent, rigid bonds. The grease is reworkable should users need to switch out parts in the future. Heat sinks will require screws or other fasteners to secure to the board.

 

  • Thermal conductivity of 0.7 W/(m·K)
  • High dielectric strength
  • Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding heat transfer paste
  • Non-electrically conductive
  • Long service life

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