Thermal Paste

he 860 is a CPU thermal paste that is silicone-based. Thermal grease like our 860 reduces thermal resistance between irregular metal surfaces. This thermal compound paste has reasonable thermal conductivity, a soft consistency and a wide operating temperature range. In some instances, these properties makes it the best thermal paste for CPU applications.

The 860 is a silicone thermal compound that is not an adhesive. While it mates the CPU to the heat sink, it does not form permanent, rigid bonds. The grease is reworkable should users need to switch out parts in the future. Heat sinks will require screws or other fasteners to secure to the board.

• Thermal conductivity of 0.7 W/(m·K)
• High dielectric strength
• Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
• Excellent corrosion resistance
• Non-bleeding heat transfer paste
• Non-electrically conductive
• Long service life

8616 is a thermal compound with excellent thermal conductivity. This thermally conductive grease conforms between irregular surfaces when compressed, reducing thermal resistance and improving heat flow. The 8616 is a non silicone thermal compound that effectively transfers heat and is electrically non-conductive.

8616 is a thermal interface material ideal to apply over parts with a small surface area. This thermal compound is a paste and is easy to remove if there is a requirement for part replacement in the future. Like thermal pads, the 8616 does not stick to parts so securing the heat sink requires use of screws. The grease has a white, soft consistency making it easy to spread and work with.

• An effective thermal transfer grease with thermal conductivity of 2.0 W/(m·K)
• Silicone-free
• Broad service temperature range of -70 to 165 °C (-90 to 329 °F)
• High dielectric strength
• Excellent corrosion resistance – passed ASTM B117 salt fog test (1,000 hours)
• Non-bleeding
• Non-electrically conductive
• Long service life