- GST NO. : 24AACPM8952F1ZO
0
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50 Kilogram (MOQ)
| Business Type | Supplier, Retailer |
| Thermal Conductivity | 2.5 W/m•K |
| Type | Two-component |
| Material | Silicone |
| Click to view more | |
Product Details
Usage
Thermal Interface Material
Cure Time
Quick Low-temperature Cure
Mix Ratio
1:1
Flame Retardant Rating
UL 94V-0
Softness After Cure
Retains Softness For Stress Relief During Thermal Cycling
TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling.
- Thermal conductivity of 2.5 W/m•K
- Quick low-temperature cure
- 1:1 mix ratio
- Flame retardant—meets UL 94V-0
- Reworkable
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