Epoxy Potting Compounds

832B is a general purpose, rigid, 2-part black epoxy. Once cured, this black potting compound provides extreme environmental and physical protection for printed circuit boards and electronics. The rich black color ensures intellectual property (IP) is secure and tamper-proof. The 832B is an ideal product where the main need is general protection with no need for any secondary features.

832B is a black epoxy resin that’s ideal for projects needing basic protection is harsh climates. Its tough finish protects circuits from sudden shock and impacts, shielding frail components and boosting the lifespan of circuits. The mixed liquid is thin, so it spreads well over surfaces and covers small parts. The black resin epoxy bonds well to most surfaces and is not corrosive to copper.

• Convenient 2A:1B volume mix ratio
• Low mixed viscosity of 3 300 cP
• Extremely high compressive and tensile strength
• Excellent adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics
• Excellent electrical insulating characteristics
• Broad service temperature range of -40 to 140 °C (-40 to 284 °F)
• Extreme resistance to water and humidity (allows for submersion where needed)
• Solvent-free

832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies.

• Translucent amber color (allows for visual inspection)
• Convenient 2A:1B volume mix ratio
• Low mixed viscosity of 2 700 cP
• Extremely high compressive and tensile strength
• Excellent adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics
• Excellent electrical insulating characteristics
• Broad service temperature range of -40 to 140 °C (-40 to 284 °F)
• Extreme resistance to water and humidity (allows for submersion where needed)
• Solvent-free

32FX is a black, 2-part, flexible epoxy potting compound. Once cured, the epoxy offers extreme environmental and physical protection for printed circuit boards and electronics. The epoxy is a dark black finish that makes it quite tough for others to steal a circuit design. The 832FX is ideal for potting more delicate parts.

The key features of the 832FX are its low viscosity and softer finish. In climates where the temperatures can quickly change, softer compounds like the 832FX are more ideal. The flexible epoxy resin does not exert as much stress on potted parts during expansion and contraction. Projects where parts are thermal cycled between temperatures may benefit from softer compounds like 832FX.

• Very flexible; low modulus
• Convenient 1A:1B volume mix ratio
• Very low mixed viscosity of 700 cP
• Good adhesion to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics
• Excellent electrical insulating characteristics
• Extreme resistance to water and humidity (allows for submersion where needed)
• Solvent-free

832FXC is a clear version of our popular black flexible epoxy potting, 832FX. It is a 2-component, clear, low-viscosity, flexible epoxy compound for potting and encapsulating circuit boards. Once cured, 832FXC has a low modulus making it suitable for applications involving aggressive thermal cycling.

• Low mixed viscosity
• Low modulus epoxy
• Clear – allows for inspection
• Strong adhesion to many substrates including metals, plastics, glass, composites, ceramics and wood
• Extreme resistance to water and humidity